OVERVIEW
Experiments with electroplating various metals onto substrates. Electroplating uses electrolysis to deposit a thin layer of metal onto a conductive surface for protection, aesthetics, or functional properties.
THE PROCESS
At cathode (object being plated): M^n+ + ne⁻ → M (metal deposits) At anode (metal source): M → M^n+ + ne⁻ (metal dissolves) Example - Copper plating: Cu²⁺ + 2e⁻ → Cu
PLATING TYPES EXPLORED
- Copper Plating - Using copper sulfate solution, often as a base layer
- Nickel Plating - For corrosion resistance and hardness
- Zinc Plating - Galvanizing for steel protection
- Tin Plating - For solderability and food-safe applications
KEY FACTORS
Current Density
Affects deposit quality
Temperature
Controls reaction rate
Solution Chemistry
pH, concentration, additives
Surface Prep
Critical for adhesion
SAFETY
Caution: Plating solutions contain heavy metals and acids that are toxic and corrosive. Some processes release hydrogen gas. Proper ventilation, PPE, and waste disposal procedures are essential.